The RIE etcher Plasmalab 80 Plus (produced by Oxford Instruments Plasma Technology, UK) is a 13.56 MHz driven parallel plate reactor with manual sample loading and a graphite substrate electrode. It is highly recommended for processing of small and non-standard substrates with Si, SiO2 and Si3N4 films.
Technical information| Wafer diameter | Up to 240 mm, optimized for 100 mm | |
| Process gases | SF6, CF4, O2, Ar, N2, CHF3 | |
| Non-uniformity over 100 mm | <2 % | |
| Working pressure range | 1-250 mTorr | |
| RF power | 20 - 300 W | |
| Typical etch rate of: | Si | 300 nm/min (isotropic) |
| SiO2 | 40 nm/min | |
| Si3N4 | 60 nm/min | |
