The Plasmalab System 400 (Produced by Oxford Instruments Plasma Technology, UK) is a parallel plate vacuum system designed for DC magnetron sputter deposition processing. The system has load lock for manual wafer loading.

Technical information

Sputtered materials (only one at the moment)	Al, Cu, Cr, Pt, W (option)
Wafer size	100 mm, smaller pieces in special holder
Wafer number in batch	8
Deposition modes	Static (higher growth rate), dynamic (better uniformity)
Typical deposition rate (dynamic)	80 nm/min
Substrate temperature	20 °C, 80 - 350 °C
Loading time of 1 wafer	5 min

DC-magnetron sputtering system with four targets (). Single wafer loadlock for 100 mm wafers.